Intel Corporation has introduced a new interconnect technology for 3D chips, which will allow you to create microcircuits from compact module modules, by analogy with the Lego constructor..
Most modern ones have a monolithic design, in which all transistors and auxiliary components are placed on a single silicon matrix. This approach has worked well for decades, but due to the difficulty of further increasing processing speed, manufacturers are creating new the way development of the industry to meet consumer expectations.
Intel plans to address this issue with Omni-Directional Interconnect (ODI) technology, which eliminates the need for only one die, allowing processors to be assembled from various modules called chiplets.
Flexibility is one of the benefits of this approach. ODI will allow the company to mix and match chips of different designs, usually sold separately, in powerful, custom-tuned processors optimized for specific applications..
The new technology will help reduce manufacturing costs. If one of the chiplets in the modular process is defective, it can be simply replaced, eliminating the need to write off the entire block.
ODI facilitates modularity by integrating the company’s two technologies. The first, EMIB, allows you to link the system chip horizontally, like puzzle pieces, the other, Foveros, makes it possible to place them one on top of another three-dimensional structure..
The new solution also brings significant design improvements. Intel has significantly increased the size of silicon through-junction and interconnects that carry power and data in chiplets. This increase in bandwidth and latency will be reduced while using fewer vias, which frees up space for additional transistors..
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Intel’s modular 3D chips may hit the market in the near future. In December, the company said it hopes to begin shipping Foveros-based modular processors in 2019.. development of a revolutionary type of transistors that consume 30 times less energy.
text: Ilya Bauer, photo: mtdata
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